3D structures (hollow structures) can be manufactured using ceramics without the use of adhesives. This is because Fine Ceramics exhibit exceptional resistance to high heat, chemicals, and plasma, and can be utilized in harsh environments where high temperature and corrosive gases and fluids flow through the internal channel.
Structures with hollow channels or bent pipes, which could not be realized by conventional machining, can be manufactured using Fine Ceramics. Because the bonding interface is integrated, there is no loss in strength or thermal conductivity, and it makes dense bonding with highly reliable accuracy possible.
Ultrasonic testing image illustrates a hollow channel structure
Sapphire monolithic bonding without adhesives maintains exceptional resistance to plasma, chemicals and heat, so it maintains mechanical strength even in a plasma or harsh chemical environment. In addition, since the joint surface cannot be seen, it can be used where transparency is required.
Compared to Quartz and Alumina, Sapphire has superior chemical resistance.
Graph showing the reduction per 1 cm3 when immersed in each chemical for 24 hours.
Sapphire has consistent transmittance over a wide wavelength range.
Sapphire and Alumina have high bonding strength and can be used where hermeticity is required. In addition, since no adhesive is used, the generation of impurities and particles around the bonded area is reduced.
Since Sapphire and Alumina can be bonded, only Sapphire can be used in areas where transparency is required.
If you would like to know more about
Kyocera's hollow and 3D structural technologies,
please feel free to contact us for more details.